The patented CSP/BallNest Hybrid Socket enables prototyping, test, or burn-in of CSP, BGA, microBGA, and LGA devices. The socket features a lid that nests each ball termination for connection reliability and can be used on any device with a 0.30-mm pitch or larger.
The ZIF-style socket attaches to the PCB in the same footprint as the socketed device. Signal path is 1.96 mm and contact forces are 15 g on a 0.30- to 0.35-mm pitch, 16 g on a 0.40- to 0.45-mm pitch, 25 g on a 0.50- to 0.75-mm pitch, and 25 g on a 0.80-mm pitch or larger. Operating temperature range is from –55° to 150°C. (50-lead BGA device, 0.3-mm pitch, $500 ea/2 — 5 to 6 weeks ARO.)
Aries Electronics , Bristol , PA
Frank Folmsbee 215-781-9956
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