Test socket offers up to 961 leads

The Textool 0.8-mm open-top BGA Type IV test and burn-in socket accepts BGA packages on an 0.8-mm pitch in body sizes to 27 x 27 mm, grid arrays up to 31 x 31, and up to 961 leads. The socket enables users to switch high lead count packages from pitches such as 1.27 and 1.0 mm to 0.8 mm, allowing package sizes for high-end logic to be reduced without sacrificing functionality.

The socket uses the company’s dual-beam contact system technology and provides balanced contact in the top hemisphere of the solder ball to reduce shear stress on the solder ball and minimizing package shift during actuation. A micro-wiping contact scrubs the oxide layer of the solder ball as well as the surface of the socket contact with each actuation. (Contact company for pricing—available now.)

3M Electronic Solutions Div. , Austin , TX
Information 888-3M HELPS
http://www.3m.com/electronics