Available in four versions with ratings of 1 to 3 GHz, 3 to 5 GHz, 5 to 9 GHz, and 10 to 18 GHz, a high-frequency center probe test socket supports devices up to 13 mm2 . The socket allows manual high-speed testing of devices such as CSP, mBGA, DSP, LGA, SRAM, DRAM, and flash memory, with pitches as low as 0.40 mm.
Solderless, pressure-mount, compression spring probes facilitate termination to and removal from the test board. Measuring 30.48 x x 21.34 x 11.18 mm, the socket minimizes signal loss via a 1.95-mm signal path. Operating temperature range is 55 to 150C. (Up to 50 positions, from $330—4 to 6 weeks ARO.)
Aries Electronics , Bristol , PA
Frank Folmsbee 215-781-9956
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