Test sockets fit high-frequency apps

The high-frequency Center Probe and CSP/MicroBGA test and burn-in sockets are now offered in sizes up to 6.5-mm2 with pitches down to 0.3 mm to enable the testing of smaller components. The sockets feature replaceable interposer sets and require minimal handler tooling for use in an increased number of CSP, MicroBGA, DSP, LGA, SRAM, DRAM, and flash devices.

Solderless pressure-mount compression spring probes are located by two molded plastic alignment pins and mounted with two stainless-steel screws to facilitate mounting to and removal. (100-lead socket, from $300 — 4 to 5 weeks ARO.)

Aries Electronics , Bristol , PA
Frank Folmsbee 215-781-9956

http://www.arieselec.com