The best electronic components of 2020

Electronic Products has announced  the winners for the 2020 Product of the Year Awards. These products are recognized for a significant advancement in a technology or its application, an exceptionally innovative design, a substantial achievement in price/performance, improvements in design performance, and/or the potential for new product designs/opportunities. EP editors evaluated over 100 products across 10 electronic component categories.

These are outstanding products that should be evaluated by designers for their technology advances and innovations. However, there were a significant number of outstanding runner-ups that should be recognized as well. You’ll find them below along with the list of Product of the Year winners.

Analog ICs

Winner: Maxim Integrated’s MAX16160 4-channel voltage monitor and reset IC

Runner-ups: Analog Devices Inc.’s ADA4355, Maxim Integrated’s MAX40660, and STMicroelectronics’ MasterGaN.

ADI ADA4355: Analog Devices Inc. (ADI) has developed an embedded optical time domain reflectometry (OTDR) receiver (pre-amp, analog signal processing and analog-digital conversion) in the smallest form-factor available today in a 6 x 12-mm BGA package, while meeting the challenging performance requirements of network equipment operators.  ADI’s ADA4355 eOTDR receiver is part of an IC component testing solution, which can be embedded directly into networking equipment for real-time detection and location of events, enabling operators to meet their service level agreements (SLAs) at lower cost and shorter mean-time to repair (MTTR). Enabling 24/7 monitoring of fiber-optic cable, the ADA4355’s small form factor allows network equipment manufacturers to embed the OTDR solution directly into the equipment for monitoring fiber-optic cables. “Prior to this development the primary method of detecting faults or “events” in optic fibers was to use a handheld OTDR instrument, a trained technician, and a truck to determine the site of the fiber bend, break, failed connector, or illegal tap,” said ADI.

Maxim Integrated MAX40660: Maxim Integrated’s MAX40660 is high-bandwidth transimpedance amplifier (TIA) that adds 32 additional channels to a LiDAR module with the same overall solution size. Compared to the closest competitive solution, the MAX40660 high-bandwidth transimpedance amplifiers enable 10 mph (15 km/h) faster autonomous driving at highway speeds by providing more than 2× higher bandwidth and accommodating 32 additional channels (128 vs. 96) to a LiDAR module within the same module size, said the company. “With more than twice the bandwidth and the ability to accommodate 33 percent more channels within the same LiDAR module size compared to the closest competitor, the MAX40660 TIA provides optical receiver designers with higher-resolution images that enable faster autonomous driving systems,” said Maxim.

STMicroelectronics MasterGaN: STMicroelectronics claims MasterGaN is the industry’s first platform to embed a half-bridge driver based on silicon technology along with a pair of  gallium-nitride (GaN) transistors. The combination aims to accelerate the creation of next-generation compact and efficient chargers and power adapters for consumer and industrial applications up to 400 W. “Today’s GaN market is typically served by discrete power transistors and driver ICs that require designers to learn how to make them work together for best performance,” said STMicro. “ST’s MasterGaN approach bypasses that challenge, resulting in faster time to market and assured performance, together with a smaller footprint, simplified assembly, and increased reliability with fewer components. With GaN technology and the advantages of ST’s integrated products, chargers and adapters can cut 80% of the size and 70% of the weight of ordinary silicon-based solutions.”

Digital ICs

Winners: Eta Compute’s ECM3532 AI multicore processor and Maxim’s MAX78000 neural network accelerator chip.

Runner-ups: Ambiq’s Apollo4 SoC, Ampere’s Altra cloud processor, Infineon’s Semper Secure, Pixelworks’ i6 processor, and STMicroelectronics’ STM32H7.

Here’s why they are significant:

Ambiq Apollo4 SoC: The ultra-low-power Apollo4 SoC family is the 4th generation system processor solution built on Ambiq’s proprietary Subthreshold Power-Optimized Technology (SPOT) platform. The integrated hardware and software solution enables battery-powered endpoint devices to achieve a higher level of intelligence without sacrificing battery life. With the Apollo4 SoC, all battery-powered endpoint devices, including wearables, hearables, far-field voice remotes, animal trackers, predictive health and maintenance devices, smart security, and smart home devices, have the possibility to last for days, weeks, months, or years on one charge or standard lithium batteries.

Ampere Altra cloud processor: Claimed as the first cloud-native processor with the highest core count, the Ampere Altra is a new class of CPU for data centers with extremely high scalability and power efficiency. Ampere Altra is a 64-bit multi-core Arm processor that features up to 80 single-threaded cores in a 1P and 160 cores in a 2P platform along with eight channels of DDR4-3200 at 2 DPC, supporting up to 4 TB memory per socket. Uses cases include data analytics, artificial intelligence, database, storage, telco stacks, edge computing, web hosting and cloud native applications.

Infineon Semper Secure: Infineon’s Semper Secure is claimed as the first memory solution to combine security and functional safety in a single NOR flash device, delivering advanced security, safety, and reliability required for today’s connected automotive, industrial, and communications systems. It’s the only external NOR flash solution that serves as a hardware root-of-trust and provides end-to-end protection that maintains device integrity and manages the confidentiality, authenticity, and access to code and data, said Infineon. The AEC-Q100 automotive-qualified NOR flash offers an extended temperature range of -30°C to 125°C, supports a 1.8 V to 3.0 V operating range, and offers densities of 128 Mb, 256 Mb, and 512 Mb. It is also fully compliant to the ISO 26262 standard and ASIL-B, and is ready to be used in systems up to ASIL-D.

Pixelworks i6 processor: The Pixelworks i6 processor is claimed as the industry’s first smartphone display ASIC with an integrated AI processing unit that adaptively tunes overall picture quality based on changes in ambient lighting, content attributes, display characteristics and usage patterns, so consumers can enjoy an always-cinematic visual experience for any content in any viewing environment. A unique AI architecture that augments fuzzy logic – a technique pioneered by key technologists at Pixelworks – enables the AI processing unit to run at significantly lower power than other AI approaches, which is a key enabler for processing dynamic content, such as video and gaming, said the company.

STMicroelectronics STM32H7: The STMicroelectronics STM32H7 microcontrollers expand the high-performance end of the the company’s STM32 family of MCUs with a range of single-core MCUs that bring high-end features such as rich graphics, AI, and state-of-the-art cyber-protection to cost-sensitive new products. They are supported by the free STM32Cube Ecosystem, which includes TouchGFX tools and Expansion Packs for the creation of full-color user interfaces, (free) tools to port neural networks to the MCU, and (free) security tools for enhanced cyber-protection, including OTFDEC (on-the-fly decryption) and Secure Firmware Install. The key innovation in the new STM32H7 microcontroller is its ability to operate at 550 MHz, the fastest core speed in the market, among MCUs that integrate Flash storage on-chip to run deeply embedded applications, said the company. In addition, the devices can interact with off-chip storage while ensuring full execution performance and security. These MCUs can handle high-resolution, full-color graphics, and video that demand a large frame buffer, to create new products that deliver more sophisticated and immersive user experiences.

Electromechanical

Winner: C&K’s Nano Tactile (NanoT) switch

 Runner-up: Snaptron’s RCG tactile dome switch

Snaptron’s RCG series tactile dome switch addresses a key pain point for customers – the loss of electrical contact between the dome and board due to the buildup of debris. It includes a unique ring – providing a 360-degree ring of contact – in the center that helps reduce the impact from contamination, assembly tolerance, or off-centered presses. “When debris obstructs the circuit in one area, the ring still makes contact in another area. This feature on the dome also ensures that electrical contact is maintained even with off-center or off-angle actuations,” said the company. The RCG dome comes standard in 5.3, 6.3, 7, 8.5, 10, and 12 mm sizes with forces ranging from 200 g to 500 g, depending on diameter, and life ratings up to 5,000,000 cycles.

 Interconnects

 Winner: Hughes Electronics’ OptiMod fiber optic and DC power cabling

 Runner-up: Schurter’s 4783 rewireable cord connector

Schurter said the 4783 series is the first rewireable cord connector, combining a detachable IEC C13 connector with the V-Lock cord retention system, designed to prevent the power cord from being pulled out of the inlet unintentionally. Rewireable cord connectors provide cost savings to customers who have small builds, or who need cord sets with varying cable lengths and country specific plugs. The 4783 is safety agency approved for the European, Chinese, and North American markets. It is also certified according to the new UL 60320 standard. No halogens in the cable guard or any other plastic components are used.

 Optoelectronics

 Winner: Seoul Semiconductor Co., Ltd.’s WICOP UHL LEDs

 Runner-up: NS Nanotech, far-UVC ShortWaveLight emitters

NS Nanotech far-UVC emitters: NS Nanotech claims the first solid-state emissive material to produce invisible shortwave far-UVC ultraviolet light that researchers say can neutralize the SARS-CoV-2 virus and other airborne pathogens. The new nitride semiconductor chips are the first solid-state devices to emit far-UVC light at wavelengths ranging from 200-to-222 nanometers (nm). It’s commonly known that germicidal UV-C light, typically at a wavelength of 254 nm, is highly effective at killing bacteria and viruses and is primarily used to disinfect all kinds of equipment, particularly medical devices. However, it is a health hazard for humans, potentially causing harm to eyes and skin, including skin cancer. Several recent research studies have shown that far-UVC light, at a wavelength of between 207 to 222 nm, can kill airborne viruses without harming human skin.

Passives

Winner: Cornell Dubilier Electronics’ PPC series of aluminum electrolytic capacitors

Runner-ups: Laird’s Hi-Temp ETX Series thermoelectric cooler and Magnetics’ Edge Powder Cores.

Laird Hi-Temp ETX series: Laird Thermal Systems has developed a thermoelectric module series that is rated for high temperature in emerging optoelectronic applications. With a robust construction, the HiTemp ETX Series thermoelectric cooler can survive in temperatures up to 150°C, exceeding most outdoor applications. It is assembled with advanced thermoelectric materials that boost cooling capacity by up to 10% compared to traditional thermoelectric coolers. These solid-state heat pumps feature a higher thermal insulating barrier when compared to standard thermoelectric materials creating a maximum temperature differential (ΔT) of up to 83°C. “We are seeing a lot of innovation in the marketplace where highly sensitive optoelectronics are getting specified into outdoor applications with worst case temperatures exceeding 90°C,” said the company. “This is a problem for these devices as they are not designed to operate at these temperatures and engineers are creatively figuring out ways to spot cool in these environments using thermoelectrics.”

Magnetics Edge Powder Cores: Magnetics calls its new Edge Powder Cores a breakthrough in powder ally core material, providing a significant improvement in DC bias performance over high flux, while also reducing AC core losses nearly in half of high flux losses. “The inherent advantage of powder alloy cores is their DC bias performance, meaning how well the material maintains inductance under current loading. For high-current inductor applications, high flux has often been the design solution that gives the smallest package size since it offers the best DC bias performance with the highest saturation level, said the company. The new material boosts that saturation level even higher. The company cited a few examples for comparison: 60 permeability Edge reaches 50% roll-off at 205 Oersteds, vs. 185-195 Oersteds for best-in-class high-flux materials, and 165 Oersteds for 6.5% silicon iron powder cores. “The fundamental innovation of Edge in the world of soft saturating alloy powder cores is the unprecedented achievement in saturation performance without the trade-off in AC power losses that would traditionally be expected,” said the company.

Power

Winner: Navitas Semiconductor Ltd.’s GaNFast Power ICs NV612x-series

Runner-up: Texas Instruments’ UCC12050 isolated DC/DC bias power supply

Texas Instruments (TI) UCC12050: The new UCC12050 is the first IC developed with TI’s new proprietary integrated transformer technology that can shrink power solutions by up to 80%. TI said this will disrupt the way designers approach isolation and electromagnetic interference (EMI). The 500-mW, high-efficiency isolated DC/DC converter features the industry’s lowest EMI, 5-kVrms reinforced isolation, and 1.2-kVrms working voltage to protect against high-voltage spikes in industrial applications, from grid infrastructure to industrial transport. The 2.65-mm height enables designers to reduce their solution volume by as much as 80% compared to discrete solutions and 60% compared to power modules – with twice the efficiency of competing devices, said the company.

RF/Microwave

Winner: InnoPhase Inc.’s Talaria TWO  INP1010 & INP1011 modules

Runner-up: Murata Electronics’ Type 1RM MICS radio module

Murata Type 1RM MICS radio module: Murata Electronics’ Type 1RM ultra-small Medical Implant Communication System (MICS) band radio module, the LBAA0PC1RMH298, is designed for use in devices with data-intensive wireless capabilities that are used to diagnose, monitor, report, and provide warnings in support of human life. Typical applications include insulin, drug, and baclofen pumps as well as arrhythmia and bladder monitors. Measuring 8.6 x 5.6 x 1.7 mm, this module is claimed as one of the smallest and most highly integrated solutions available. What differentiates the LBAA0PC1RMH298 from alternative products is Murata’s proprietary technique that discretely bundles several technological components and ICs into one miniatured package, resulting in an advanced module that delivers a communication range up to two meters, an ultra-low current consumption of 0.2 uA sleep state, and a 128 kb/s data rate.

Sensors:

Winner: Texas Instruments Inc.’s TMP61 linear thermistor family

Runner-ups: Infineon Technologies’ 6th gen REAL3 3D image sensor and Maxim Integrated’s MAXM86146 dual-photodetector optical sensor

Infineon 6th gen REAL3 3D image sensor: Opening up new consumer and industrial use cases, the latest generation REAL3 3D image sensor from Infineon Technologies is a 3D depth sensor based on the company’s Time-of-Flight (ToF) technology featuring the longest range on the market, up to 10 m, frame-by-frame scaling resolution from 40 kpixels at close range to 600 pixels at maximum range, and depth data in real time with a capture speed in the order of milliseconds. This 6th generation ToF imager directly provides 3D date to smart phone cameras (no added processing required as with stereo imagers). It also features up to 40 percent lower power consumption reduction of the imager module and a 35 percent reduction in footprint (imager measures 18 sq. mm and module is just 100 sq. mm) compared to the previous state-of-the solution, said Infineon. It enables differentiated camera performance in a variety of ranges, light conditions, and use cases while saving battery life in mobile devices. It supports real-time augmented reality, long range scanning, small object reconstruction, fast low-power auto focus, and picture segmentation.

Maxim Integrated: MAXM86146 dual-photodetector optical sensor:  Maxim Integrated touts the thinnest dual-photodetector optical sensor solution for wearable health and fitness products. The MAXM86146 combines two photodiodes, an optical AFE and a microcontroller with built-in algorithms (activity classification, heart rate, SpO2) in a 0.88-mm package that is 45 percent thinner versus a discrete approach. It also delivers a faster time to market with a drop-in module solution that cuts development time by up to six months, according to the company. The turnkey drop-in module includes built-in algorithms for heart-rate and oxygen-saturation (SpO2) monitoring, as well as advanced activity classification.

Test and measurement

Winner: Keysight’s CX3300A Anomalous Waveform Analytics

Runner-up: ASSET InterTech’s ScanWorks JTAG-based platform of hardware debug, validation and test tools

ASSET InterTech ScanWorks: ASSET InterTech’s enhanced ScanWorks JTAG-based platform of hardware debug, validation, and test tools, enables engineers to more easily test the device interconnects between silicon ‘chiplets’ in multi-die packages and shorten the time to program flash memories from hours to minutes. ScanWorks now can quickly generate test patterns in the Standard Test Interface Language (STIL) that can be applied by chip-level automatic test equipment (ATE) to test for shorts and opens between chiplets. “Previously, implementors of multi-die packages would manually write their own ad-hoc test scripts to generate the interconnect test patterns that would then be converted into STIL,” said the company, “but now, ScanWorks can take the netlist for such a package and directly generate the STIL test patterns to be applied by an ATE system, thus providing a simplified turnkey and automated test authoring solution for chiplets in multi-die packages.”