The FL901AO B-stage thermal adhesive-preform film is 100% solid, and formulated to act as the heat-transfer path between heat-generating components and heat sinks or other cooling devices. Quickly curable at moderate temperatures, (for example,. 1 hour at 125°C or 30 to 40 min at 150°) the adhesive offers almost no squeeze-out during bonding.
Shock, vibration, and impact-resistant, the adhesive’s properties are maintained over temperatures from 100° to 400°F and over prolonged exposure to harsh environmental conditions. Weight loss at 600°F is less than 0.6%, thermal conductivity measures 10 BTU in./ft2 hr°F, and volume resistivity exceeds 10 x 1012 Ω-cm. The film preform is available in a range of thicknesses and can be laser or die cut to the configuration of any part. (Contact company for pricing and availability.)
Master Bond , Hackensack , NJ
Information 201-343-8983
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