The company has reintroduced its once-discontinued Sarcon XR-e thermal-interface material. The silicone-based material provides a thermal conductivity of 11 W/m-K with a low thermal resistance ranging from 0.11 to 0.35°C-in.2 /W depending on material thickness.
The thermal interface material is designed to remove high levels of unwanted heat from components such as CPUs and semiconductors by making contact between the heat source and nearby heat sinks. The thermal gel compound is suitable for filling uneven mating surfaces and air gaps ranging from 1.75 to 0.30 mm. (Contact Frank Hobler for pricing and availability.)
Fujipoly America , Carteret , NJ
Frank Hobler 732-969-0100
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