The Sarcon 25GR-T2d, a soft and highly conformable thermal interface medium, is suitable for low and high-volume production applications. The 0.255-mm-thick TIM offers engineers a durable and cost-effective solution for tight tolerance die-cut operations.
Used between a heat source such as a semiconductor and a nearby heat sink, the gap filler pad provides a thermal conductivity of 1.5 W/m°K, and a thermal resistance as low as 0.33°C-in.2 /W. It is recommended for applications with operational temperatures between –40° and 150°C. Precut sheets are available to a maximum size of 200 x 400 mm. (Contact company for pricing and delivery.)
By Carolyn Mathas
Fujipoly America , Carteret , NJ
Frank Hobler 732-969-0100
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