Thermal jumper reduces component temperature by over 25%

By Gina Roos, editor-in-chief

Vishay Intertechnology, Inc. has released the ThermaWick THJP series of surface-mount thermal jumper chips that removes heat from electrically isolated components by providing a thermal conductive pathway to a ground plane or heat sink. The Vishay Dale thin-film device features an aluminum nitride substrate with a high 170 W/mK thermal conductivity and can reduce the temperature of connected components by over 25%.

By removing the heat, this enables designers to either increase the power-handling capability of these devices or extend the useful life at existing operating conditions while maintaining the electrical isolation of each component. It also improves overall circuit reliability by protecting adjacent devices from thermal loads, said Vishay.

Thanks to a low capacitance down to 0.07 pF, the thermal jumper chips are well-suited for high-frequency and thermal ladder applications. The thermal conductor can be used in power supplies and converters, RF amplifiers, synthesizers, pin and laser diodes, and filters for industrial and telecommunications applications.

The series is available in six case sizes from 0603 to 2512, with custom sizes available. In addition, the 0612 and 1225 cases feature long side terminations for additional heat-transferring capability. The thermal jumper is available with lead (Pb)-bearing and lead (Pb)-free wraparound terminations.

Samples and production quantities are available now, with lead times of six weeks. Pricing for U.S. delivery starts at $0.33 each in quantities of 10,000.