Thermal material offers bond lines of 5 µm

Thermal material offers bond lines of 5 µm

The EPM1-2493 low-viscosity, low modulus silicone elastomer material features a nominal thermal conductivity of 1 W/mK. It provides bond lines as thin as 5 um and can be used to adhere to materials with differing coefficients of thermal expansion (CTE) for significant stress reduction during thermal cycling. The material reduces or prevents contamination of electronic device components used in applications exposed to high heat, such as solder reflow at 260C.

The silicone elastomer adheres well to aluminum, and its adhesive strength can be improved with the use of a primer, achieving average lap shear values of 120 psi (0.8 MPa). The material is a pourable, conformal liquid that is suitable for potting/filling recessed areas and applying to intricate geometries in electronic applications. It can also be used for adhering integrated circuit substrates, base plates or heat sinks, or where grooves or other configurations require a limited flow material. (Contact company for price and availability.)

By Paul O’Shea

NuSil Technology , Carpinteria , CA , United States
Information 805-684-8780
www.nusil.com