Thermal material suits high-power devices

Designed for use between a high-power electrical device requiring electrical isolation from the heat sink, the High Flow 650P thermally-conductive phase change material is reinforced with a polyimide film. Naturally tacky on one side, the film offers a 5,000-Vac dielectric breakdown voltage, thermal conductivity of 1.5 W/m-K, and a thermal impedance of 0.20°C-in2 /W at 25 psi.

The material is reliable in temperatures to 150°C. Available in standard thicknesses of 0.0045-, 0.0050- and 0.0055-in. and with a 1.0, 1.5 or 2.0 mil Polyimide reinforcement carrier. (Contact company for pricing and availability.)

By Christina D’Airo

Bergquist , Chanhassen , MN

Jerry Schmitz 800-347-4572

www.bergquistcompany.com