Navigant talks smart thermostats
The market for communicating and smart thermostats has evolved through an early technology adoption phase into a stable and growing market. According to Navigant, there has been significant activity in 2015 with partnerships, international expansion, technological growth, and more conclusive evidence of cost-effectiveness of thermostats. For example, collaborations between ecobee and Carrier and Nest and solar provider SolarCity, as well as continued expansion of global marketing on behalf of Nest and tado, are some key examples of this activity.
Heightened awareness of residential energy management and growing interest in particular devices, such as the Nest and ecobee smart thermostats, have fueled an end-consumer-based spike in the smart thermostat market in recent years. Despite challenges such as the affordability of energy in areas where demographics and infrastructure support adoption, smart thermostats have a relatively bright future. Newer players like tado have given longtime vendors, such as Honeywell and Carrier, some additional competition. Moreover, the new players have disrupted the status quo by going direct to consumers, attracting early adopters and a few mainstream consumers, as well.
Thermal design challenges engine control
Mentor offers an article that focuses on thermal design decisions during development of an Engine Control Unit (ECU). It includes modeling from component, PCB to full enclosure and mounting level considerations. The article discusses some of the design challenges for reliability in harsh operating environment and dissipating heat from high power density components.
Aavid thermal interface materials
Aavid Thermalloy , announces the release of three new lines of premium thermal interface materials including SuperThermal , SoftFlex, and WaveBlocker. The new lines of thermal gap fillers are designed to increase the performance and capabilities of electronics' design. SuperThermal offers high thermal conductivity of up to 13.2 W/meter Kelvin. SoftFlex is composed of 5 materials varying in elasticity, conductivity, cushioning ability and compliancy. The softness and compressibility makes the SoftFlex line good for decreasing board strain and for applications with increased shock or vibration. WaveBlocker gap filler features high electromagnetic permeability that dampens EMI and is optimized for applications requiring high signal accuracy. It enables designs for products such as radios, audio equipment, testing equipment and a huge range of military and aerospace applications.
coolingZONE-15 Summit
The 15th annual coolingZONE Thermal Management Summit for electronics thermal engineers take place October 20 to 22, 2015 in a globally-accessible, online summit covering thermal management, heat transfer and energy transport at all hardware levels from individual components to the Internet of Things. Get a complete list of speakers and topics, plus the full schedule and registration tools at http://www.coolingzone.com/event.php?eventid=60 .
Advertisement
