Thermal substrates dissipate heat from visible LEDs

Thermal substrates dissipate heat from visible LEDs

Improve isolation between copper circuit and aluminum cladding

Thermally conductive substrates dubbed OptoTherm OCB201 dissipate heat from visible-light-emitting diodes in solid-state lighting applications. The heat-spreader substrates provide a thermal conductivity of 1.1 W/m°K and a thermal resistance of 1.8°C/W, and feature a 0.004-in.-thick dielectric to improve isolation between the copper circuit and aluminum cladding.

Dielectric breakdown is 4 kVdc, and copper and aluminum thicknesses are 0.0042 and 0.062 in., respectively. Maximum substrate panel size is 18 x 16.5 in., with available thicknesses of 0.038, 0.070, and 0.133 in. (Contact Mike King for pricing and availability.)

OPTEK Technology , Carrollton , TX
Mike King 972-323-2200

http://www.optekinc.com/products/vled.asp