Tiny BNCs mount on PCB edge adhesive-free

Targeting broadcast and telecom applications up to 4 GHz, E-Snap Series 361EHD704 high-density 75-Ω board-edge BNC connectors are 51% smaller than traditional BNC devices, permitting four times the density They are also 40% smaller than the DIN 1.0/2.3.

Using proprietary E-Snap technology, the BNCs lock securely into PC board solder-pasted holes without adhesives prior to reflow soldering. Strain on the solder joint is thus significantly reduced, as is the time and expenses related to applying adhesives. End launch mounting allows optimal VSWR and return loss capabilities. The connectors are rated for use in 3G applications, (From $4.54 ea / 1,000 — available from stock to 10 weeks ARO.)

By Richard Comerford

Bomar Interconnect Products , Ledgewood , NJ
Bob Behrent 973-347-4040

www.bomarinterconnect.com/ESnappage2.htm