Infineon Technologies AG, in collaboration with 3D time-of-flight (ToF) specialist partner pmdtechnologies ag, has extended its family of REAL3 integrated (i-ToF) 3D image sensors with the introduction of the IRS2976C ToF VGA sensor. Targeting 3D camera systems, the new sensor delivers a quantum efficiency of 30 percent or higher, thanks to Infineon’s pixel technology, while maintaining the cost advantage of front-side illumination (FSI) sensors.
(Source: Infineon Technologies)
Infineon said achieving this level of quantum efficiency has only been previously achieved by back-side illumination (BSI) sensors. In addition, the IRS2976C sensor is the first ToF imager to pass Googles Class 3 (Strong) certification for face ID, while operating under the mobile device’s display.
Infineon also offers an optimized IRS9102C VCSEL driver that in combination with the highly integrated IRS2976C delivers the smallest 3D camera systems at optimized costs, according to the company.
The IRS2976C imager can be used in a variety of long-range, low-power use cases that enable a measurement range of 10 meter and further. Applications include secure authentication for smartphones, payment terminals, smart door locks, virtual and augmented reality (AR/VR) headsets, service robots and other IoT devices.
The IRS2976C offers system VGA resolution of 640 x 480 depth points. Like all members of the REAL3 family, each pixel is integrated with pmdtechnologies’ patented suppression of background illumination (SBI) technology for high dynamic range (HDR) and sunlight scenes.
The VGA image sensor also claims the smallest form factor of 23 mm² and it is drop-in compatible to the previous IRS2877C imager for an easy upgrade path.
Engineering samples of the IRS2976C imager are available. Infineon will showcase the new product at Mobile World Congress (MWC) 2023 in Barcelona, Spain in Hall 5a, Booth #51.
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