Tool advances single, multi-technology design for RF PAs

Tool advances single, multi-technology design for RF PAs

The ADS2012 RF and microwave EDA platform advances single, multi-technology design for multichip RF power amplifier module design. The tool offers new user interface enhancements designed to improve design efficiency and productivity. Dockable windows, for example, enable users to access frequently used dialog boxes, such as component information and layer visibility in layout. New component search and net navigator functions make it easy to work with larger designs, and a new archive/un-archive utility makes sharing designs and workspaces easier.

Two ADS DesignGuides have also been updated. The ADS Load Pull DesignGuide now offers mismatch simulation to indicate device or amplifier sensitivity to load VSWR or phase angle. The Amplifier DesignGuide features extensive updates that make it easy to see amplifier performance at a specific output power or a specific amount of gain compression.

Other features include unparalleled integration with EMPro that enables 3-D EM components to be saved as database cells for use directly in ADS and a new ADS electro-thermal simulator based on a full 3-D thermal solver.It also include Multichip module EM simulation setup and Finite Element Method simulation of different technologies which analyze EM interactions between ICs and interconnects, wire bond and flip-chip solder bumps in typical multichip RF power amplifier modules.(Contact company for pricing and availability)

By Christina Nickolas

Agilent Technologies , Santa Clara , CA
Sales 800-829-4444
www.agilent.com