Toshiba America Electronic Components, Inc. (TAEC)* announced two photocouplers for high-speed communications: the TLP2767 and TLP2367. The new photocouplers are housed in small, 2.3mm (max) low-height packages and meet various international safety standards, including UL1577 and EN60747-5-5. They are designed for applications such as programmable logic controllers, I/O interface boards, photovoltaic inverters, and factory automation inverters.
The TLP2767 is the first 50Mbps photocoupler in the industry to provide both a creepage and clearance distance of 8mm and isolation thickness of 0.4mm, supporting reinforced isolation. It features isolation voltage of 5000Vrms (min) and is housed in a SO6L package. The TLP2367 provides creepage and clearance distance of 5mm (min) and isolation voltage of 3750Vrms. It is available in a 5-pin SO6 package. Both the TLP2767 and TLP2367 contribute to lowering the operation voltage of equipment with supply voltage of 2.7V to 5.5V, at temperatures up to 125°C.
With a propagation delay time of 20ns (max), pulse width distortion of 8ns (max), and propagation delay skew of ±10ns (max), the photocouplers can be used to reduce the dead time of various interfaces, which can improve the power efficiency of equipment. On the input side, the TLP2767 and TLP2367 feature Toshiba's original high output infrared LEDs to reduce the threshold input current by approximately 20 percent, compared with existing Toshiba products[1]. On the output side, a photo detector IC fabricated with a CMOS process reduces the supply current by approximately 50 percent, compared with existing Toshiba products[1]. This can lower power consumption and cost reduction of equipment.
Main Specifications
(Isolation voltage @Ta=25°C, Other characteristics @Ta=-40 to 125°C) 
Pricing and Availability
Toshiba’s new photocouplers are now shipping. For more details, samples, and pricing information, please contact your local Toshiba Sales Office.
Notes
[1] Toshiba’s TLP117 (MFSOP6 package)
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