By Carolyn Mathas, contributing writer
As advanced connected and autonomous vehicle applications continue to generate vast quantities of data, memory storage demands are pushed even higher. Toshiba Memory America, Inc. is meeting the challenge with its embedded Automotive UFS JEDEC Version 2.1 lineup. Integrating BiCS FLASH 3D flash memory and a controller in one package yields higher performance and density well beyond automotive e-MMC-/UFS-based storage solutions currently in use.
The Toshiba BiCS FLASH embedded memory solution combines greater high-speed read/write performance and low power consumption for connected car and autonomous vehicle applications requiring high-capacity storage for, as well as the smaller-capacity requirements of, wireless communication.
Automotive UFS products integrate Toshiba’s BiCS FLASH 3D flash memory and a controller in a single package to meet the data storage demands of today’s data-rich automotive environment.
Key features of the BiCS FLASH lineup include an expanded operating range of −40°C to 105°C, compliance with AEC-Q100 Grade 2 specifications, a wide capacity range, and increased sequential read and write performance. For example, at a capacity of 256 GB, there is an improvement in sequential read and write performance of approximately 6% and 33%, respectively, over previous generations.
The new memory solutions also deliver new functions specific to automotive applications, including a refresh function to refresh UFS-stored data and to help extend the data’s lifespan; a thermal control function to protect against overheating in extreme automotive environments; and extended diagnosis to help users better understand the device’s status.
The BiCS FLASH 3D flash memory lineup consists of four capacities, including 32 GB, 64 GB, 128 GB, and 256 GB. Sampling of the 32-GB capacity is now underway, while 64 GB, 128 GB, and 256 GB are currently available.
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