Featuring a low volume resistivity of 5−10 Ω-cm, EP21TDCN-LO is a nickel-conductive system for high-performance bonding and sealing applications. This smooth paste formulation is easy to handle and has a one-to-one mix ratio by weight or volume. It is a toughened system, formulated to withstand relatively rigorous thermal cycling as well as mechanical vibration and shock. This epoxy’s good electrical and thermal conductivity makes it well-suited for grounding, shielding, and static dissipation applications.
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