UV laser enables rapid wafer scribing, dicing

UV laser enables rapid wafer scribing, dicing

The AVIA 355-23-250 UV laser is said to offer the highest pulse repetition rate of any Q-switched UV laser, allowing it to perform high-speed wafer-die singulation with high yields. The 355-nm laser can deliver over 8 W at repetition rates of 250 kHz and higher for high-process throughput with minimal microcracking of the silicon.

The laser’s output can be quickly tailored by users to operate at a 250-kHz repetition rate with low pulse energy for scribing, or at lower repetition rates with pulse energies as high as 80 µJ for dicing. Beam quality is M 2

Coherent , Santa Clara , CA
Tim Edwards 408-764-4598

http://www.coherentinc.com