Win Your University Research Program a Multi-Application FINEPLACER bonder

Win Your University Research Program a Multi-Application FINEPLACER bonder

Finetech Shows Support for University Research

Finetech will donate a high-accuracy die bonder in a drawing this summer that is open to U.S. and Canadian qualified universities and colleges. Th with 5 micron placement accuracy is valued at $100,000.

In conjunction with the company’s 20th anniversary this year, Finetech is celebrating the university R&D segment of its business. With a wide installed base of systems at some of the most prestigious institutions, FINEPLACER die bonders provide an ideal solution with precision and repeatability in a platform that is perfect for advanced technology environments utilizing diverse applications.

The FINEPLACER Pico MA is an “all-in-one” modular platform for advanced packaging and assembly applications — such as flip chip, optoelectronics, 3-D, wafer-level integration, micro-optics assembly, sensor packaging and precise die bonding.

For more information or to register for the drawing, visit http://www.finetechusa.com/bonders/products/promotion.html.