Winbond Ships One Billionth Serial Flash Memory, Ramps 90nm Production, Increases Market Share

Winbond Ships One Billionth Serial Flash Memory, Ramps 90nm Production, Increases Market Share

• First Serial Flash Supplier in Full Production at 12-inch Wafer Fabrication Facility • Expands Family of 90nm Multi I/O SpiFlash Memories from 1 to 128 Megabits

Taichung, Taiwan – April 12, 2010 — Winbond Electronics Corporation, a leading global supplier of Serial Flash and inventor of the popular Multi-I/O Serial Flash architecture, today announced it has reached a significant industry milestone – the company has shipped more than one billion SpiFlash® memories. Additionally, Winbond announced it is quickly ramping production of its 90-nanometer (90nm) SpiFlash memories at the company’s 12-inch-wafer fabrication facility in Taichung, Taiwan. Winbond is the first supplier to manufacture Serial Flash memories on 12-inch wafers, bringing much-needed volume to the tightly supplied Serial NOR Flash market. Winbond’s 90nm Multi-I/O SpiFlash family ranges from 1-megabit (1Mb) to 128Mb densities and features the popular Serial Peripheral Interface (SPI), Dual-SPI and Quad-SPI, allowing for the industry’s highest performance.

Serial Flash Growth Continues

“Worldwide Serial Flash shipments have grown from less than one billion units in 2006 to 2.4 billion in 2009, and are expected to reach 3.8 billion units generating 2 billion dollars in revenue by 2013.” said Alan Niebel, founder and CEO of Web-Feet Research, Inc. “Winbond, one of the largest suppliers and a pioneer in this segment, has played an important role in enabling the migration from Parallel Flash to Serial Flash. Considering the present shortage in the Serial Flash market, Winbond is well positioned for growth as one of the few suppliers that is significantly increasing capacity across all densities in 2010.”

“We are very pleased with the success of our SpiFlash Memory product line, which in the last few years has reached shipments of over one billion devices,” said Tung Yi Chan, president of Winbond Electronics Corporation. “With increased capacity from our 12-inch wafer fab, we are now ramping production of our 90-nanometer SpiFlash products and will likely ship near one billion units in 2010 alone.”

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