Infineon Technologies AG has expanded its wireless connectivity solutions with the introduction of the AIROC Bluetooth LE and 802.15.4 system on chip (SoC) family that supports low-power Matter products, an emerging protocol for smart home connectivity. The new AIROC CYW30739 wireless combo SoC launch marks the company’s entrance into the 802.15.4 market with low-power solutions.
The AIROC CYW30739 delivers a scalable and interoperable solution to connect low-power devices by providing complementary Bluetooth LE and 802.15.4 protocols, while also enabling end-to-end encrypted communication between individual devices in a Matter network. It features a low-power radio and is said to offer superior RF performance without connection drops. The low-power consumption supports applications that require extended battery life including smart home, smart building, and smart lighting.
“These design techniques and process technology are extremely efficient to help reduce active and idle power,” said Infineon.
The AIROC CYW30739 integrates a 96-MHz Arm Cortex-M4 microcontroller unit with a floating point unit that delivers high-performance computing and a highly optimized memory system across flash, RAM, and ROM, said Infineon. The AIROC SoC also provides -95.5 dBm LE Rx and -103.5 dBm 802.15.4 sensitivity for long-range Bluetooth and multi-protocol connectivity.
Infineon offers software support for Matter in the open-source Matter repository, and additional Matter-specific capabilities in Infineon’s ModusToolbox Software and Tools. The latest version of ModusToolbox is available now for download.
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