Researchers develop computer-on-a-chip prototype with breakthrough NVM memory
The proof-of-concept multi-bit chip — developed by CEA-Leti and Stanford University — solves NVM’s read/write, latency, and integration
Author: Gina Roos
The reality of virtual reality
AR and VR applications are becoming a key battleground for smartphones and wearables such as smart glasses and, in particular, head-mounted
INT’s AMOLED display technology delivers highest pixel density for VR/AR designs
Aims to set a new standard for high-definition HMDs for robotic, military, industrial, and commercial
Need parts for your next VR/AR design?
Here’s a sampling of products, ranging from sensors and drivers to tactile switches and
Raychem CANbus cables offer speeds up to 1 Mbits/s
Operates in harsh environments, including military ground systems, marine, and aerospace
Researchers unveil microfluidics heat sink
Imec demos the next generation of chip coolers, a miniature microfluidics heat sink for high-performance chip
‘Breakthrough’ BAW technology improves network performance and reliability
TI delivers the first two chips based on its new BAW technology that also will increase immunity to shock and vibration, shrink the BOM and PCB area, and reduce design
PCIe 4.0 clocks offer low power for automotive designs
PCIe 4.0 clock generators and buffers are AEC-Q100 Grade 2-qualified, making them suitable for any automotive PCIe
3D printer creates plastic parts 8 times faster
Researchers have developed a new manufacturing system and process that is eight times faster than conventional 3D
‘Dunkable’ promises system-level waterproofing over lifetime of smartphones
P2i’s Dunkable nano-coating technology protects smartphones, including the PCB and components, even when water enters the gadget through a crack or failed