Here are the 25 finalists:
Analog/Mixed-Signal ICs
Silicon Labs: Si5391 Clock IC
Silicon Labs’ Si5391 clock ICclaims the industry’s lowest-jitter, any-frequency clock generator. It is the only clock generator on the market that can provide all clock frequencies needed in 200/400/600G designs from a single IC while delivering sub-100-fs RMS phase jitter performance for 56G SerDes reference clocks. Featuring up to 12 differential outputs, the Si5391 clock is available in frequency-flexible A-/B-/C-/D-grade options. A Precision Calibration P-grade option optimizes RMS phase jitter performance with a 69-fs (typical) specification for the primary frequencies needed in 56G SerDes designs. The Si5391 is a true sub-100-fs “clock-tree-on-a-chip” solution designed to synthesize all output frequencies from the same IC while meeting 56G PAM-4 reference clock jitter requirements with margin.
SiTime: Elite Platform Super-TCXO
SiTime’s Elite Platform Super-TCXOs are tight-stability (±0.1-ppm to ±2.5-ppm), 1- to 220-MHz precision oscillators with exceptional dynamic performance and rich features. These devices solve deep-rooted timing problems for telecom, networking, and precision GNSS systems. They can be used to replace legacy quartz OCXOs in emerging 5G and IEEE 1588 synchronization applications while reducing power and size.
Interconnects
Amphenol ICC: OSFP Interconnect System
The OSFP IO system is an industry-standard 8-transmission lane-based connector, cage, and cable (copper and optical) interconnect system that is designed to address the industry’s needs for present-day aggregate per-port bandwidth needs of 200G and 400G as well as the anticipated future per-port bandwidth needs of 800G. The system features a complete IO system that offers fully shielded connector and cages in multiple configurations (ganged and stacked) that accept both copper-based and optical-based interconnect components (cables, transceivers, etc.) as well as passive and active copper cables and active optical cables (AOC). Because the system design takes into account the necessary mechanical, electrical, and thermal requirements, the use of the OSFP system enables the user to allow for the plugging of short-length (cables) or short-range/long-range optical transceivers without concern for proper system thermal management.
HARTING: iX Industrial Ethernet Connector
The RJ45 connector has been the standard Ethernet interface in IP20 environments for many years. However, as the demand for smaller devices and sensors increases, the RJ45’s size limits the potential for miniaturization. HARTING said that this is why it developed the ix Industrial Ethernet connector, which is a smaller and more rugged connector than the standard RJ45. It also offers Cat. 6A performance for 1-/10-Gbit/s Ethernet at the control level. The ix Industrial offers a new standard in Ethernet connectivity that is 70% smaller and more robust than the RJ45.
Digital ICs
MediaTek: P60/P70
MediaTek’s Helio P60 system-on-chip (SoC) is the first SoC platform to feature a multi-core AI processing unit (APU) and MediaTek’s NeuroPilot AI technology. The SoC delivers up to a 70% CPU performance boost over the Helio P23 and Helio P30 in addition to a 70% GPU performance enhancement, powering the latest AI features while still being energy-efficient. By offering the cutting-edge features that consumers desire without a flagship price, the Helio P60 continues MediaTek’s legacy of making great technology accessible to everyone. Editor’s note: MediaTek also recently launched the Helio P70 SoC with an enhanced AI engine combined with CPU and GPU upgrades for more powerful AI processing. Helio P70 also comes with upgraded imaging and camera support, a gaming performance boost, and advanced connectivity features in an ultra-power-efficient chipset.
Microchip: SAMA5D2 System-on-Module (SoM)
There is extensive design effort and complexity associated with creating an industrial-grade MPU-based system running a Linux operating system, said Microchip, and even experienced developers spend a lot of time on PCB layout to guarantee signal integrity for the high-speed interfaces to DDR memory and Ethernet PHY while complying with EMC standards. The SAMA5D2 system on module (SOM) simplifies design by integrating the power management, non-volatile boot memory, Ethernet PHY and high-speed DDR2 memory on a small, single-sided PCB. Microchip’s SAMA5D2 SOM is a single-sided PCB with 169 components including the Arm Cortex-A5-based SAMA5D2 SiP that integrates DDR2 memory in a single package, simplifying designs by removing high-speed memory interface constraints from a PCB.
Electromechanical Devices
CUI: AMT21 and AMT23 Absolute Modular Encoders
CUI’s AMT21 and AMT23 series are rugged, high-accuracy absolute modular encoders outputting 12 bits or 14 bits of absolute position information. The AMT21 series, featuring high-speed RS-485 communication, and the AMT23 series, designed with a synchronous serial interface (SSI), are based on CUI’s proprietary capacitive sensing technology. The capacitive platform offers a highly durable and accurate position feedback solution that is resilient to dirt, dust, and an oil typically encountered in motion applications. Housed in compact packages measuring as small as 1.53 × 1.12 × 0.40 in. (39 × 28 × 10 mm) with a locking hub for easy installation, the two series boast a low current draw of 8 mA at 5 V and accuracy of ±0.2 mechanical degrees, making them ideally suited for battery-powered industrial, robotics, and automation applications.
Sensata: NOVA 22 DR45 SSR
The Sensata Technologies NOVA 22 DR45 solid-state relay (SSR) is made for use in industrial machinery, HVAC&R, and railway vehicles. This new DIN rail-mount SSR offers high power density up to 60 A at 40°C in a compact, 45-mm package and is the only solid-state relay capable of accepting output wires up to 3 AWG with a true IP20 protection rating. The SSR is ready to use with an integrated heat sink designed to provide the appropriate thermal resistance for the application without the need for cumbersome calculations, simplifying the specification process for the user. Cage clamp output connections provide a finger touch-safe IP20 protection rating and allow for quick and easy installation of large wires directly to the SSR without the need for lug terminals or other accessories. Input connection options include standard screw or spring cage terminals for flexible design into a variety of applications. Designed for superior thermal performance, the DR45 solid-state relay features optional built-in overvoltage protection, contactor configurations, and either AC or DC control. The new SSR is available in a wide AC output voltage range of 48 to 600 VAC and holds C-UL-US, VDE, CE, and RoHS approvals.
MPUs/MCUs
GreenWaves Technologies: GAP8 IoT Application Processor
The GAP8 IoT application processor by GreenWaves Technologies enables massive deployment of low-cost, battery-operated intelligent devices that capture, analyze, classify, and act on fusion of rich data sources such as images, sounds, or vibrations. GAP8 is uniquely optimized to execute a large spectrum of image and audio algorithms including convolution-neural-network inference with extreme energy efficiency. GAP8 allows industrial and consumer product manufacturers to integrate artificial intelligence and advanced classification into new classes of battery-operated wireless edge devices for IoT applications including image recognition, counting people and objects, machine health monitoring, home security, speech recognition, consumer robotics, and smart toys. By enabling autonomous operation, GAP8 dramatically reduces deployment and operating costs of a wide range of intelligent edge devices.
Microchip: SAML10/SAML11 Microcontrollers
The SAM L10/L11 MCU families for low power and high security are based on the Arm Cortex-M23 core, with the SAM L11 featuring Arm TrustZone for Armv8-M, a programmable environment that provides hardware isolation between certified libraries, IP, and application code. The SAM L11 features robust security with chip-level tamper resistance, secure boot, and secure key storage. When combined with TrustZone technology, this is designed to protect customer applications from both remote and physical attacks. Microchip has also partnered with Trustonic and Secure Thingz to simplify and enhance security on the SAM L11. Both families offer the industry’s lowest power consumption. When benchmarked for power consumption, the SAM L10 received a ULPMark score of 405, which is over 200% better performance than the nearest competitor certified by EEMBC. They also include capacitive touch capability with best-in-class water tolerance and noise immunity.
Renesas: RZ/A2M Microprocessor
The Renesas RZ/A2M microprocessor is designed for embedded AI-based imaging in smart appliances, service robots, and industrial machinery that require high-speed image processing. It features a unique hybrid approach to image recognition or machine vision by combining proprietary dynamically reconfigurable processor (DRP) technology for fast pre-processing of image data closely coupled to an Arm Cortex-A9 CPU with large on-chip RAM for AI inferencing. The RZ/A2M MPU features Renesas’ exclusive DRP technology for real-time image processing at low power consumption to deliver 10× the image processing performance of its predecessor, the RZ/A1, and it supports the MIPI camera interface, which is widely used in mobile devices. The innovative RZ/A2M architecture couples the DRP to an Arm Cortex-A9 CPU and features an industry-leading 4 MB of on-chip RAM and MIPI camera interface support, as well as two-channel Ethernet support for enhanced network functionality and an on-chip hardware encryption accelerator enhanced secure functionality.
Optoelectronics
Lumileds: LUXEON 5050
Lumileds introduced an upgraded LUXEON 5050 that sets the standard for high lumens-per-watt (lm/W) for high bay and street lighting applications. With newly released LM-80 reliability data, the product also meets DLC Premium V4.1 requirements, enabling fixture manufacturers’ access to high utility rebates and energy savings. LUXEON 5050 features the best performance of all multi-die emitters on the market, reaching flux levels of 350 lm and 175 lm/W at 2-W LED drive conditions (4,000K, 70 CRI at 85°C). But the advantage goes beyond superior flux, said Lumileds. The round LES (4.6 mm) eases optic design. With the industry’s lowest thermal resistance (2 K/W), the LUXEON 5050 further enhances performance by removing heat and reducing heat sink requirements.
TT Electronics: OP207CL IR Emitter
TT Electronics has introduced a compact, infrared LED emitter with the industry’s largest spot diameter of 7 mm for super-reliable optical sensing and position encoder applications. With up to 10-mW total radiated power at the maximum drive current of 100 mA, and 2.25° angle of half-intensity, the OP207CL couples optical flux extremely efficiently onto the receiving photo-sensor to ensure clearly detectable on/off transitions. The integrated collimating lens creates a tight beam profile for use with accuracy-dependent devices such as radial or linear encoders for absolute or incremental measurement, as well as long-range light curtains, edge detectors, scanners, and general optical sensing and switching. Having a wide operating temperature range of –40°C to 105°C, the OP207CL can withstand demanding environments in a wide range of applications including industrial automation, safety systems, robotics, security detectors, or other equipment requiring dependable position, proximity, or motion sensing.
Passive Components
Cornell Dubilier: THA Series Thinpack Aluminum Electrolytic Capacitors
Cornell Dubilier Electronics, Inc. (CDE) has announced a significant new development in aluminum electrolytic technology. Its 85°C THA Series Thinpack capacitors are only 8.2 mm thick and 9 mm thick for the 105°C THAS Series. This is comparable in height to V-chip electrolytics, tantalums, and board-mounted axials but with much higher bulk-storage capability. A single THA/THAS capacitor can replace an array of SMT, axial or radial aluminum electrolytic, or solid tantalum capacitance arrays. That substitution can allow engineers to design smaller products,with simplified assembly and higher reliability. The THA/THAS Series design is radically new yet based on CDE’s 20+ years of experience with MIL-grade flat electrolytics, said CDE. Re-engineered to be thinner and more cost-effective, it is a good fit for many of today’s high-performance electronics. Unlike traditional cylindrical electrolytics, a THA/THAS capacitor has a sealed, laser-welded aluminum case to eliminate the need for space-wasting end seal gaskets for up to a 60% space reduction.
Littelfuse: PolySwitch setP Series Temperature Indicator
PolySwitch setP Series Temperature Indicator protects USB Type-C and USB Power Delivery charging cables from dangerous overheating faults. Unlike earlier temperature monitoring solutions like placing a PPTC or mini breaker on the power (VBUS) line, the power-independent setP is unique because it is designed to be located on the communication channel, where it senses the temperature increase and then leverages the inherent behaviors of the USB Type-C charging system to alert the charging port to shut down the power flow. Because it is placed on the communication channel rather than the power line, the setP does not contribute to power loss. The compact 0805 (mils) footprint of the setP Temperature Indicator makes it at least 50% smaller than solutions that require placing a device on the power line. Being much smaller allows it to fit more easily inside the connector. The same setP device can be used to protect cables designed for any power level, providing the same reliable protection at the lowest and highest possible levels allowed within USB-C.
TDK: CeraCharge Solid-State Rechargeable Battery
TDK Corp. developed the first solid-state rechargeable battery in SMD technology, the CeraCharge, which is based on a solid ceramic electrolyte. Depending on requirements, the number of charge/discharge cycles range from several dozens to up to 1,000. With its compact EIA 1812 package (4.5 × 3.2 × 1.1 mm), it offers a capacity of 100 µAh at a rated voltage of 1.4 V. This battery is also capable of delivering currents in the order of several mA for short periods. Thanks to the SMD technology, placement of the battery is easy, and it can be processed using reflow soldering techniques, which, in turn, reduces the production cost of the end product. In contrast to most common technologies, CeraCharge is a solid-state rechargeable battery with no liquid electrolyte. The battery is based on a multilayer technology, similar to MLCCs. This means that a relatively high energy density and smallest volume are combined with the safety and high-volume manufacturing benefits of ceramic multilayer components. In addition, the use of a solid ceramic element as an electrolyte rules out the risk of fire, explosion, or leakage of liquid electrolyte. To increase the capacity and the voltage, any number of individual CeraCharge components can be connected in series and parallel. This opens up a wide range of possible applications — particularly in devices intended for the IoT. These include, for example, real-time clocks, Bluetooth beacons, wearables, or systems for energy harvesting.
Power
Renesas: ISL81601 and ISL81401 Buck-Boost Controllers
Renesas Electronics Corp. announced an innovative new family of bidirectional four-switch synchronous buck-boost controllers. The ISL81601 and ISL81401 are the industry’s only true bidirectional controllers that sense peak current at both ends and provide cycle-by-cycle current limit in both directions while in buck or boost mode. The controllers generate point-of-load (PoL) and voltage rail conversions with peak efficiency up to 99%. The ISL81601 has a wide input range of 4.5 V to 60 V and produces a 0.8-V to 60-V output to support most industrial batteries: 12 V, 24 V, 36 V, and 48 V. Also available is the ISL81401, a 4.5-V to 40-V input and 0.8-V to 40-V output version, and its unidirectional counterpart, the ISL81401A. The new controllers are well-suited for DC power backup and battery-powered medical, industrial, and telecommunication systems.
Texas Instruments: LMZM23600/1 DC/DC Step-Down Converters
Texas Instruments (TI) introduced two new 4-V to 36-V power modules that measure 3.0 × 3.8 mm and require only two external components for operation. The 0.5-A LMZM23600 and 1-A LMZM23601 DC/DC step-down converters achieve up to 92% efficiency, which minimizes energy loss, and feature tiny MicroSiP packaging that shrinks board space by up to 58%. The converters expand TI’s power module portfolio to address up to 1-A performance-driven, space-constrained communication and industrial designs, including field transmitters, ultrasound scanners, and network security cameras. In addition, the 30-µA quiescent current increases light-load efficiency and extends battery life in battery-powered applications.
Texas Instruments: Active Clamp Flyback Chipset
Operating at up to 1 MHz, Texas Instrument’s new active clamp flyback chipset combines the UCC28780 active clamp flyback controller and the UCC24612 synchronous rectifier controller to help cut the size of power supplies in AC/DC adapters and USB Power Delivery chargers in half. Designed to work with both gallium-nitride (GaN) and silicon (Si) FETs, the UCC28780’s advanced and adaptive features enable the active clamp flyback topology to meet modern efficiency standards. With multimode control that changes the operation based on input and output conditions, pairing the UCC28780 with the UCC24612 can achieve and maintain high efficiency at full and light loads. Multimode control enables efficiency up to 95% at full loads and standby power of less than 40 mW, exceeding Code of Conduct (CoC) Tier 2 and U.S. Department of Energy (DoE) Level VI efficiency standards.
RF/Microwave
Movandi: BeamX 28/39 5G RF Front-End System
Movandi’s new BeamX 28 and BeamX 39 solutions provide a fully integrated RF front-end system in a modular, high-performance design to support a broad range of 5G millimeter-wave applications, including base stations, small cells, and mobile broadband access points. However, operating in the millimeter-wave band presents several unique technical challenges versus traditional connectivity and cellular systems, including a requirement for high performance in low-cost bulk CMOS foundries; overcoming transmission losses caused by distance, blockage, and non-line-of-sight conditions; and the fact that to achieve longer range, beamforming antennas are often required, adding to system complexity, said Movandi. The company has taken a completely new approach by developing an entirely new foundation for 5G devices by using a system-level design approach and has overcome many of the technical challenges of 5G millimeter-wave networks.
Nordic Semiconductor: nRF52840 BLE SoC
Nordic Semiconductor’s nRF52840 Bluetooth Low Energy (BLE) system-on-chip (SoC) — the high-end variant of Nordic’s nRF52 Series of high-performance Bluetooth 5-certified SoCs — is now available in production volume. The nRF52840 accompanies the mid-range nRF52832 and baseline nRF52810 SoCs in Nordic Semiconductor nRF52 Series. With a wealth of features and peripherals, the SoC offers the capabilities and flexibility to support a broad range of networked, connected products for wearables, gaming, VR/AR, and home and industrial IoT applications. The high-end nRF52840 SoC, based on Nordic’s proven nRF52 Series architecture, is the first single-chip solution to bring all of the benefits of Bluetooth 5 to the market. The key advantages of Bluetooth 5 compared with previous implementations of the BLE specification include: 2× on-air raw data bandwidth (2 Mbps); 4× range; 8× broadcasting ability with advertising extensions that increase the advertising packet payload size to 251 bytes; and an improved channel coexistence algorithm. In addition, the nRF52840 SoC is the only multiprotocol device on the market to offer concurrent Bluetooth 5 and Thread support.
ON Semiconductor: RSL10 Bluetooth 5 Radio SoC
ON Semiconductor has extended its RSL10 family of Bluetooth 5-certified radio systems-on-chip (SoCs) with a ready-to-use 6 × 8 × 1.46-mm system-in-package (SiP) module. Supporting Bluetooth Low Energy wireless profiles, RSL10 devices can be easily designed into any “connected” application including sports/fitness or mHealth wearables, smart locks, and appliances. The RSL10 SIP features a built-in antenna, RSL10 radio, and all required passive components in one complete, miniature solution. Certified with the Bluetooth Special Interest Group (SIG), the RSL10 SIP significantly reduces time to market and development costs by removing the need for any additional RF design considerations. With the 2-Mbits/s speeds possible with Bluetooth 5 alongside the industry’s lowest power consumption, the RSL10 family provides advanced wireless functionality without compromising battery application life. RSL10 consumes just 62.5 nanowatts (nW) while in Deep Sleep mode and 7-mW peak receive power. RSL10’s energy efficiency was recently validated by the EEMBC’s ULPMark, where it became the first device in the benchmark’s history to break 1,000 ULP Marks and produced Core Profile scores more than twice as high as the previous industry leader.
Sensors & Transducers
ams: AS7265x Multi-Spectral Sensor Solution
ams’ AS7265x multispectral sensor family is the first multi-chip set from ams to incorporate nano-optical interference filters deposited directly on the CMOS silicon die cost-effectively enough to open entirely new application opportunities. The AS7265x is a cost-effective, 18-channel multi-spectral sensor solution that opens the door to a wide range of new spectral sensing applications. The AS7265x incorporates three chips to deliver an 18-channel sensing array covering wavelengths from 410 nm to 940 nm. Each AS7265x device has two integrated LED drivers with programmable current and can be timed for electronic shutter applications. Operating as a three-chip set, the devices include electronic shutter capabilities with three independent 100-mA LED drive controls, which means that device designers can accurately control multiple light sources to enhance the spectral sensing functions without added componentry.
ams: CMV50000 CMOS Image Sensor
The CMV50000 is the industry’s first global shutter CMOS image sensor to offer high resolution of 48 megapixels (MP), more than twice the resolution of its previous generation. The CMV50000 is a high-speed CMOS image sensor with 7,920 × 6,004 effective pixels (47.5 MP) developed for machine-vision and video applications. The image array consists of 4.6-μm pipelined 8T global shutter pixels, which allow exposure during read-out, while performing true correlated double sampling (CDS) operation. The image sensor has 22 12-bit sub-LVDS data outputs. The image sensor also integrates a programmable analog gain amplifier and offset regulation. Each output channel runs up to 830 Mbits/s maximum, which results in 30-fps frame rate at full resolution in 12 bits. Higher frame rates can be achieved in row-windowing mode or row-subsampling mode. Operating at a fast 30 fps with 12-bit pixel depth at full resolution or a binned 4K mode, and at up to 60 fps with pixel subsampling to 4K resolution, the sensor is suitable for use in high-speed machine-vision systems, as well as in TV broadcasting and video cameras.
Bosch Sensortec: BMA400 Accelerometer
Bosch Sensortec launched the BMA400 , an ultra-low-power acceleration sensor for wearables and IoT applications. The BMA400 draws 10× less current than existing accelerometers while delivering solid high performance. Its greatly reduced power demand significantly extends battery lifetime, especially on coin-cell–powered devices. Usually, accelerometers have to choose between low power and high performance. Due to continuous measurement, the sensor’s high-quality measurement signal has precisely defined cutoff frequencies, making it very resistant to vibrations. This is particularly useful in IoT use cases such as smart home security systems, wherein the BMA400 can distinguish between real alarm situations like broken glass and false signals coming from random vibrations. Therefore, false alarms triggered by vibrations coming from the outside environment, such as construction works, are easily prevented.
The award winners for each category will be announced in December and featured in EP’s January 2019 issue.
Although this year’s selection focuses on component-level products, we’ve discovered that there were a number of significant complete solution/platform launches such as development kits, reference designs, and partnership solutions introduced over the past year that are outstanding and should be acknowledged. We plan to add a category next year to award these innovations. Here are some significant launches (not in any particular order) that EP has covered in 2018:
RoboSense develops $200 LiDAR system for autonomous vehicles
ACEINNA launches IMU development kit for drones, robots, and AGVs
Partnership delivers first active stereo camera 3D-sensing solution
Automotive HD camera module reference design fits on single PCB
First wrist-worn wearables platform rolls for ECG, heart rate, and temperature monitoring
15-DOF sensor kit promises low power, flexibility for IoT design
*Note: Many of the product descriptions were provided by the component manufacturers.
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Learn more about Amphenolams (formerly austriamicrosystems)Bosch SensortecCornell DubilierCUI IncElectronic Products MagazineHARTINGInc. of North AmericaLittelfuseLumiledsMediaTekMicrochip TechnologyNordic SemiconductorON SemiconductorRenesas Electronics AmericaSilicon LabsTDK AmericaTexas InstrumentsTT electronics
