Editor’s Note: AspenCore Media’s editors have been closely following the development of the Heterogeneous Integration Roadmap (HIR). As part of this Special Project on the topic, we solicited perspectives from celebrated heterogeneous integration proponent Nicky Lu, Intel Fellow Ravi Mahajan, and veteran packaging analyst E. Jan Vardaman.
Dylan McGrath, EE Times’ editor-in-chief, begins the special report by discussing the HIR efforts by various players in the industry that are mapping out the future of the semiconductor industry beyond Moore’s Law.
Because the concept of heterogeneous integration encompasses rapidly evolving design concepts, packaging architectures, device types, materials, manufacturing processes, and systems integration technologies, the HIR effort involves participation from throughout the supply chain — chipmakers, materials suppliers, equipment companies, test/assembly providers, EDA firms, and others, said McGrath.
The HIR effort aims to identify the requirements for heterogeneous integration (HI) in the electronics industry through 2031, identifying challenges and potential solutions. A draft of the roadmap is now expected to be released in mid-October, followed by annual updates.
The report also includes several contributed pieces from luminaries of the industry on the topic of HI. Ravi Mahajan, an Intel Fellow, makes the case for heterogeneous integration. Nicky Lu, chairman, CEO, and founder of Etron Technology, discusses the benefits of HI and why the roadmap needs much broader and deeper participation from a more diversified group of technical, business, and application stakeholders. E. Jan Vardaman, founder and president of consulting company TechSearch International Inc., addresses the importance of the roadmap as a guide to determine the most appropriate package for a specific application.
Below is a listing of all stories in this Special Package:
Mapping the Future of Electronics
Dylan McGrath, editor-in-chief, EE Times
Increasingly, engineers and chip firms are eyeing the concept of heterogeneous integration — separately manufactured silicon and non-silicon components integrated into a higher-level system in the same three-dimensional system-in-package — as the electronics productivity driver of the future.
The Case For Heterogenuous Integration
Ravi Mahajan, Intel
Heterogeneous integration offers computing and communications devices enhanced functionality, faster time to market, and silicon yield resiliency.
Why I’m Involved With the HI Roadmap
Nicky Lu, Etron Technology
As Moore’s Law — which has driven exponential economic and industry growth — reaches its limits, the semiconductor, IC, and microelectronics industries need another exponential growth driver.
A Big Journey Calls for a Map
E. Jan Vardaman, TechSearch International
Heterogeneous integration is an economic solution that addresses the end of silicon scaling, as historically documented by Gordon Moore.
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