By Gina Roos, editor-in-chief
Texas Instruments has claimed the industry’s smallest 36-V, 4-A power module in a quad flat no-lead (QFN) package. The TPSM53604 DC/DC buck module’s 5 × 5.5-mm footprint enables engineers to shrink the size of their power supply by 30% while reducing power loss by 50% when compared to similar competing modules, said TI.
The new power module comes with a single thermal pad to optimize heat transfer. This enables engineers to simplify board mounting and layout. TI said that 42% of the TPSM53604’s QFN package footprint touches the board, which enables more efficient heat transfer compared to ball-grid-array (BGA) packages. In addition, the module’s buck converter integrates MOSFETs with low drain-source on-resistance (RDS(on) ) to enable conversion efficiency of 90% at 24 V to 5 V.
The TPSM53604 can operate in ambient temperatures as high as 105°C, which makes the module suitable for applications in factory automation and control, grid infrastructure, test and measurement, industrial transport, and aerospace and defense.
Engineers can create a complete power solution from a 24-V input down to the point of load when pairing the TPSM53604 with a compact step-down module such as the TPSM82813 and TPSM82810 , said TI.
The TPSM53604 is available from TI and authorized distributors. Pricing starts at $3.65 in quantities of 1,000. The TPSM53604 evaluation module is available on TI.com for $49. TI also offers production quantities of the TPSM53602 (2-A) and TPSM53603 (3-A) modules, available through TI and its authorized distributors. Pricing starts at $2.64 and $3.21 in quantities of 1,000, respectively.
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