Embedded world 2023: COMs, SIPs, SOMs and SBCs
Embedded world 2023 showcased a variety of modules, including COMs, SIPs, SOMs, as well as SBCs and wireless...
Boards
LATEST ARTICLES
EP’s Top 10 articles of 2022
The biggest industry trends, including the IoT, Industry 4.0, smart cities, and EVs topped Electronic Product’s top 10 articles in...
PICMG defines COM-HPC Mini pinout and footprint
PICMG’s COM-HPC Mini standard is one step closer to ratification after finalizing the pinout and dimension...
Innodisk launches AI camera modules
Innodisk’s AI camera modules support image recognition for applications ranging from smart charging stations to production...
GaN Systems extends Class D audio portfolio
GaN Systems has expanded its GaN-powered Class D audio family with two GaN FET amplifier boards and two audio boost converter...
MWIR camera module delivers fast integration
Teledyne FLIR’s latest Neutrino MWIR camera module enables fast integration into commercial, industrial, and defense...
