LATEST ARTICLES
Developed for data center applications, Allegro Microsystems claims the industry’s first three-phase BLDC driver with integrated power loss brake, which lowers BOM costs while improving thermal...
Researchers at ICN2 and ICMM-CSIC have developed a 2D thermo-functional material for radiative cooling, which can cool surfaces without energy consumption or gas...
Cadence claims its new system analysis tool, Celsius Thermal Solver, is the industry’s first complete electrical-thermal co-simulation solution for electronic systems from ICs to physical...
Laird’s Peltier cooler modules provide spot cooling for sensitive electronics that have operating temperatures below 70°C, including smart DLP automotive...
Looking at heat in electronic devices in a new way, Stanford researchers have developed a heat shield that is roughly 50,000× thinner than a sheet of...
Laird’s HiTemp ET Series of thermoelectric modules offers active cooling in temperatures ranging from 80°C to...
