Hot Chips 2019 highlights new AI strategies
Machine learning and neural network processing took center stage at this year’s Hot Chips event with two different approaches to AI chips
Tag: Device Packaging
Heterogeneous integration is the future of the semiconductor industry
Heterogeneous integration encompasses rapidly evolving design concepts, packaging architectures, device types, materials, manufacturing processes, and systems
IC package: five key design considerations
Here is what you need to know while selecting a packaging technology for your
Isolation pkg for IGBTs features best-in-class thermal performance
TRENCHSTOP advanced isolation package technology replaces FullPAKs and standard- and high-performance isolation
Advanced packaging: five trends to watch in 2017
Here is a bird's eye view on how advanced packaging technologies are catching up with demands for integrating more die content in a single package in order to enhance
Metal packaging market revenue predicted to go up by 2020
In metal packaging, the various products are enclosed or packaged with covering of metal like steel, aluminum or tin. The metallic material work as a barrier and it
Packaging Materials: Strong Growth Rates for Small Form Factors
Growth is entirely attributed to the chip-scale package (CSP) leadframe form
Column: Packaging designers are taking the heat
One thing that’s becoming a particular focus for packaging designers and their customers today is dealing with
3D printing and PCB development
Three-dimensional printing of printed circuit boards (PCBs) lets design engineers test their ideas, eliminating costly rework and providing significant value to product
Metal parts – the only way 3D printing can become productive
Metals are the fastest-growing segment of 3D printing, with printer sales growing at 48% and material sales growing at
