By Gina Roos, editor-in-chief
Power and battery management chips were top of mind for product designers last week. Power management is key to delivering higher efficiency and maximizing battery life as well as lowering total system costs across end markets. However, enclosure trends such as greater security, cooling and connectivity, garnered the most interest. New artificial intelligence (AI) chips and strategies also held the attention of engineers as more products and technologies become AI enabled.
1. Enclosure designs deliver more options
Enclosures and cabinets are becoming more application-specific and feature greater security, cooling, weatherproofing, and connectivity choices than previous offerings
2. Hot Chips 2019 highlights new AI strategies
Machine learning and neural network processing took center stage at this year’s Hot Chips event with two different approaches to AI chips emerging
3. Achieving energy efficiency on the factory floor
Energy-saving chips, like power modules, microprocessors, and FPGAs, are one piece of the puzzle in driving energy efficiency in factory automation.
4. Top 10 power management ICs for Industry 4.0
Power management ICs are becoming more highly integrated for Industry 4.0, packing advanced features that deliver higher efficiency and eliminate the need for many external components
5. Battery management IC extends battery cell life for EVs
Renesas’ automotive-grade battery management IC maximizes battery cell life and driving range for hybrid and electric vehicles
Advertisement
Learn more about Electronic Products Magazine
