LATEST ARTICLES

Embedded world 2024: COMs, SIPs and SOMs

Embedded world 2024 showcases the latest developments in embedded modules, including COMs, SIPs and...

Ceva’s Ceva-Waves Links multi-protocol wireless platform IP family accelerates MCU and SoC connectivity for IoT and smart edge-AI...

TDK’s ICU-10201 ultrasonic ToF sensor with on-chip processing delivers the accuracy needed for low-power IoT and robotics...

IoT encompasses many technologies and devices, and making them interoperable, secure and energy-efficient is a big challenge for...

The Eclipse Foundation’s IoT and Edge Commercial Adoption Survey Report reveals that IoT deployments and investments rose significantly in...

Multi-layered security strategies ensure that connected RPM solutions do not create more health risks for...