CUI Devices adds BGA heat sinks
CUI Devices has expanded its thermal management portfolio with a new line of BGA heat sinks in a range of sizes and...
Thermal Management
LATEST ARTICLES
Thermoelectric coolers rated up to 150°C for optoelectronics
Laird Thermal Systems has launched a series of thermoelectric coolers that deliver active cooling in high-temp environments and increased cooling...
Chiller platform cools 3D-printing systems
Laird’s Nextreme Recirculating Chiller Platform offers low noise and up to 50% lower energy consumption compared to conventional compressor-based...
Keeping cool with thermoelectric cooler assemblies
With the ability to heat and cool, thermoelectric cooler assemblies deliver precise temperature control in a compact size, while their solid-state construction delivers high reliability for years of service with little or no degradation in performance and...
Thermoelectric cooler increases cooling capacity by 10%
Laird Thermal Systems has released a new generation of thermoelectric coolers that increases heat pumping capacity by 10%, along with a higher temperature differential and higher...
Thermal jumper reduces component temperature by over 25%
Vishay’s ThermaWick thermal jumper chip removes heat from electrically isolated components, enabling higher power handling or longer useful...
